IEC 62276 Ed. 1.0 en:2005, Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods
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Wafer Saw Popular Q&A
Q: What is the maximum number of cracks allowd on a wafer due to waf...
A: The semiconductor industry is VERY protective of its proprietary process information, and I suspect that this would qualify. You might be able to find out if yo... Read More »
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Wafer Saw Helpful Resources
Minco Technology Labs, LLC: Silicon Wafer - Saw, Cutting, and ...
Wafer saw is the first and most critical step in our die processing operation. There are many variables involved in sawing wafers. At Minco when we formulate the ...
Product Information | Dicing and Cutting Saws - DISCO Corporation
A dicing saw is capable of machining a semiconductor wafer into small squares, or die. A cutting saw is used to slice materials such as magnetic heads for ...
Micross Components | Wafer Sawing
Wafer Sawing Micross Components is experienced in wafer dicing (singulating a wafer into individual die) a wide variety of materials, including silicon, silicon ...
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